Investigation of poly (2-methyl imidazole co 1,4-butanediol diglycidyl ether) as a leveler for blind hole copper plating

  • Xiangjian Zeng School of Chemical Engineering and Light Industry, Guangdong University of Technology
  • Qiuman Zhou School of Chemical Engineering and Light Industry, Guangdong University of Technology; School of Materials Science and Engineering, South China University of Technology
  • Zhenjie Yuan School of Chemical Engineering and Light Industry, Guangdong University of Technology
  • Lixin Huang School of Chemical Engineering and Light Industry, Guangdong University of Technology
  • Guanghui Hu School of Chemical Engineering and Light Industry, Guangdong University of Technology
  • Nian He Guangdong Lear Chemicals Co., Ltd
  • Qingming Zeng Guangdong Lear Chemicals Co., Ltd
  • Zhanchang Pan School of Chemical Engineering and Light Industry, Guangdong University of Technology
Ariticle ID: 3354
166 Views, 45 PDF Downloads
Keywords: copper plating, blind holes, leveler, poly (2-methylimidazol co 1, 4-butanediol diglycidyl ether)

Abstract

The current synthetic leveler agents are complex to operate, troublesome to purify, and low to pore filling rates. Herein, we report a new, simple, green, and inexpensive method for the synthesis of leveler agents and study their properties systematically. In acidic copper sulfate plating solutions, including polyethylene glycol (PEG), sodium 3,3’-dithiodipropane sulfonate (SPS), and chloride ions, the relation between leveler agents (dimethylimidazole and 1,4-butanediol diglycidyl ether) and the filling of blind holes have been investigated. The synthesized leveler agent was structurally characterized by infrared spectroscopy and gel chromatography tests. The plating containing the leveler agent passed plating tests as well as reliability tests and met PCB production requirements. The electrochemical behavior of the leveler agent was investigated using electrochemical tests. The X-ray diffractometer (XRD) was used to observe the differences in crystal orientation on the surface of the plated layers.

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Published
2023-09-09
How to Cite
Zeng, X., Zhou, Q., Yuan, Z., Huang, L., Hu, G., He, N., Zeng, Q., & Pan, Z. (2023). Investigation of poly (2-methyl imidazole co 1,4-butanediol diglycidyl ether) as a leveler for blind hole copper plating. Materials Physics and Chemistry, 5(1). https://doi.org/10.18282/mpc.v5i1.3354
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Article