Call for Papers for the Special Issue: Electronics and Telecommunications

2019-05-05

The Introduction of the Special Issue

Materials science is currently immovably settled interdisciplinary field to different zones of science and technology including the properties of issue of composites materials and their applications. It incorporates components of connecting science mainly known as physics, chemistry and biology and in addition compound, mechanical, common and electrical engineering etc. The premise of all materials science investigates the growth, development and preparation of new materials, and in addition their processing, fabrication, bonding and encapsulation, together with the dependability, failure analysis, quality affirmation and characterization with the entire scope of uses. Material science as a vast subject consist of interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, biological and biomedical materials.

 

The Research Scope of the Special Issue

·Materials science and technology

·Nanomaterials and nanocomposites

·Novel electronic material

·optoelectronic materials

·Semiconductors

 

Submission guidelines

All papers should be submitted via the Electronics and Telecommunications submission system: http://ojs.piscomed.com/index.php/CET/index

Submitted articles should not be published or under review elsewhere. All submissions will be subject to the journal’s standard peer review process. Criteria for acceptance include originality, contribution, scientific merit and relevance to the field of interest of the Special Issue.

 

Important Dates

Paper Submission Due: Waiting for confirmation

 

The Lead Guest Editor

Suresh Sagadevan