The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding
Abstract
As electronic components develop toward high power, high package density, and device size miniaturization, heat dissipation and electromagnetic interference between electronic components are becoming more and more serious. In order to solve the adverse elec tromagnetic waves and heat radiation generated by electronic devices, people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic interference resistance. This paper summa rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.
References
Li Q, Chen L, Gadinski M R, et al. Flexible high-temperature dielectric materials from polymer 105 nanocomposites[J]. Nature, 2015, 523(7562): 576-579.
Razeeb K M, Dalton E, Cross G L W, et al. Present and future thermal interface materials for electronic devices[J]. International Materials Reviews, 2017, 36: 1-21.
Moore A L, Shi L. Emerging challenges and materials for thermal management of electronics[J]. Materials Today, 2014, 17(4): 163-174. 110.
Chen H, Ginzburg V, Jian Y, et al. Thermal Conductivity of Polymer-Based Composites: Fundamentals and Applications[J]. Progress in Polymer Science, 2016, 59: 41-85.
Hansson J, Nilsson T M J, Ye L, et al. Novel nanostructured thermal interface materials: a review[J]. International Materials Reviews, 2018, (37): 1-24.
Franklin, A. D. Nanomaterials in transistors: From high-performance to thin-film applications[J]. Science, 2015, 115 349(6249): aab2750-aab2750.
Huang L, Li J, Li Y, et al. Lightweight and flexible hybrid film based on delicate design of electrospun nanofibers for high-performance electromagnetic interference shielding[J]. Nanoscale, 2019, 11: 8616-8625.
Chao W, Vignesh M, Jie K, et al. Overview of Carbon Nanostructures and Nanocomposites for Electromagnetic 120 Wave Shielding[J]. Carbon, 2018, 140: 696-733.
Burger N, Laachachi A, Ferriol M, et al. Review of thermal conductivity in composites: mechanisms, parameters and theory[J]. Progress in Polymer Science, 2016, 61: 1-28.
Shen B, Zhai W, Zheng W. Ultrathin Flexible Graphene Film: An Excellent Thermal Conducting Material with Efficient EMI Shielding[J]. Advanced Functional Materials, 2014, 24(28): 4542-4548.
Bai L, Zhao X, Bao R Y, et al. Effect of temperature, crystallinity and molecular chain orientation on the thermal conductivity of polymers: a case study of PLLA[J]. Journal of Materials Science, 2018, 53(14): 10543-10553.
Xu Y, Kraemer D, Song B, et al. Nanostructured polymer films with metal-like thermal conductivity[J]. Nature Communications, 2019, 10(1): 1771.
X.H. Li, P.F. Liu, X.F. Li, F. An, P. Min, K.N. Liao, Z.Z. Yu, Vertically aligned, ultralight and highly compressive all-graphitized graphene aerogels for highly thermally conductive polymer composites, Carbon, 2018, 140: 624-633.
Lian G, Tuan C C, Li L, et al. Vertically Aligned and Interconnected Graphene Networks for High Thermal Conductivity of Epoxy Composites with Ultralow Loading[J]. Chemistry of Materials, 2016, 28(17): 6096-6104.
Hao H, Wen D, Qingwei Y, et al. Graphene Size-dependent Modulation of Graphene Framework Contributing to Superior Thermal Conductivity of Epoxy Composite[J]. Journal of Materials Chemistry A, 2018, 6: 12091-12097.
Chen Y, Hou X, Kang R, et al. Highly flexible biodegradable cellulose nanofiber/graphene heat-spreader films with improved mechanical properties and enhanced thermal conductivity[J]. Journal of Materials Chemistry C, 2018, 6: 12739-12745.
Wang X, Wu P. Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading[J]. Chemical 125 Engineering Journal, 2018, 348: 723-731.
Li Q, Katakami K, Ikuta T, et al. Measurement of thermal contact resistance between individual carbon fibers using a laser-flash Raman mapping method[J]. Carbon, 2019, 141: 92-98.
Qin M, Xu Y, Cao R, et al. Efficiently Controlling the 3D Thermal Conductivity of a Polymer Nanocomposite via a Hyperelastic Double-Continuous Network of Graphene and Sponge[J]. Advanced Functional Materials, 2018, 28(45): 1805053.
Hou X, Chen Y, Dai W, et al. Highly thermal conductive polymer composites via constructing micro-phragmites communis structured carbon fibers[J]. Chemical Engineering Journal, 2019, 375: 121921.
Chung D D L. Electromagnetic Interference Shielding Effectiveness of Carbon Materials[J]. Carbon, 2001, 39(2):279-285.
Chao W, Vignesh M, Jie K, et al. Overview of Carbon Nanostructures and Nanocomposites for Electromagnetic Wave Shielding[J]. Carbon, 2018, 140: 696-733.
Huang L, Li J, Li Y, et al. Lightweight and Flexible Hybrid Film Based on Delicate Structure Design of 1D Nanofibers for High-Performance Electromagnetic Interference Shielding[J]. Nanoscale, 2019,11(17): 8616-8625.
Shahzad F, Alhabeb M, Hatter C B, et al. Electromagnetic interference shielding with 2D transition metal carbides (MXenes)[J]. Science, 2016, 353(6304): 1137-1140.
Zhang P, Ding X, Wang Y, et al. Segregated double network enabled effective electromagnetic shielding composites with extraordinary electrical insulation and thermal conductivity[J]. Composites Part A, 2019, 117:56-64.
Zhang X, Zhang X, Yang M, et al. Ordered multilayer film of (graphene oxide/polymer and boron nitride/polymer) nanocomposites: An ideal EMI shielding material with excellent electrical insulation and high thermal conductivity[J]. Composites Science & Technology, 2016, 136:104-110.
Copyright (c) 2021 Houbao Liu, Renli Fu, Weisong Dong, Yingjie Song, Hao Zhang
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
Authors contributing to this journal agree to publish their articles under the Creative Commons Attribution-Noncommercial 4.0 International License, allowing third parties to share their work (copy, distribute, transmit) and to adapt it, under the condition that the authors are given credit, that the work is not used for commercial purposes, and that in the event of reuse or distribution, the terms of this license are made clear. With this license, the authors hold the copyright without restrictions and are allowed to retain publishing rights without restrictions as long as this journal is the original publisher of the articles.
