The Progress of Composites with High Thermal Conductivity and Electromagnetic Shielding

Houbao Liu, Renli Fu, Weisong Dong, Yingjie Song, Hao Zhang


As electronic components develop toward high power, high package density, and device size miniaturization,  heat dissipation and electromagnetic interference between electronic components are becoming more and more serious. In order to solve the adverse elec  tromagnetic waves and heat radiation generated by electronic devices, people have high hopes for electronic packaging materials with high thermal conductivity and electromagnetic interference resistance. This paper summa  rizes the research status of high thermal conductivity composite materials and electromagnetic shielding composite materials. Finally, the latest research results of high thermal conductivity and electromagnetic shielding composites are introduced, and the future development trend of new materials for microelectronic packaging is prospected.


Composite Materials; High Thermal Conductivity; Electromagnetic Shielding

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DOI: http://dx.doi.org/10.18282/mpc.v1i4.846


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